Global Probe Card Market

Market Insights
A probe card is a medium between an electronic test system and a semiconductor wafer that is used to inspect the quality of integrated circuits or large-scale integration during the manufacturing of semiconductors. The probe card serves as an electrical path between the test system and the circuits on the wafer, allowing the circuits to be tested and validated. With the increasing application of semi-conductors across end-users, primarily electronic and manufacturing, demand for probe cards is expected to remain robust in the forecasted period. To meet the growing demand for integrated circuits used in an increasing number of electronic devices, semiconductors are being used in a wider range of manufacturing facilities. As a result, manufacturers are focusing on expanding their production capabilities by establishing new facilities.

Segmental Analysis
The Global Probe Card Market is segmented based on by type, by application, and by region. Based type market is categorized into Cantilever Probe Card, MEMS Probe Card, and Vertical Probe Card. By application it is segmented DRAM, Flash, Foundry & Logic, and Others. Based on region it is categorized into: North America, Europe, Asia-Pacific, South America, and MEA.

Top Players Company Profiles
• FormFactor(US)
• MPI (Taiwan)
• SV Probe (US)
• Microfriend (South Korea)
• Korea Instrument (South Korea)
• Feinmetall (Germany)
• Advantest (Japan)
• Will Technology (South Korea)
• Japan Electronic Materials (Japan)
• TSE (South Korea)

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Recent Developments
• In December 2021, FormFactor opened a new manufacturing facility for semiconductor wafer probe card production in California. The initiative was taken to increase probe card production capacity. The production facility will help the company meet rising customer demand. More products with significant features will be available on the market.
• In April 2021, a new wafer probe card with a spring contact probe as a contact element was introduced by FEINMETALL GmbH. The product was launched by the company due to its unique features for contacting chips and probes that are independently spring-loaded and have a special tip style.